Perform preform software#

thickness distribution by manipulating consecutively the preform geometry (thickness and shape) and the operating parameters subject to process and design constraints. The strategy allows for targeting a specified container. The numerical approach combines a constrained gradient-based optimization algorithm that iterates automatically over predictive finite element software. Our Application Engineers will work with you to determine the best alloy for your application.In this work, a new design approach was developed to automatically and consecutively predict optimal preform geometry and optimal operating conditions for the stretch blow molding process. Will it operate in very high or very low temperatures, or be subjected to vibration? If so, you need to select an alloy that will stand up to these conditions. The operating environment of the completed assembly is also an important consideration for alloy selection.It is important to consider the shape of the final preform in the alloy selection process.

Metals and alloys have different characteristics that can affect the ease with which they can be made into different shapes and thicknesses.

For example, tin-based solders will scavenge the gold from gold-plated parts, forming brittle intermetallics, so indium-based solders are generally recommended in these cases.

Next, consider the materials being soldered and what solder is most compatible with them.

A general rule is to select an alloy that melts at least 50☌ higher than the operational temperature of the part being soldered.

Alloy selection should be based on strength and other required physical properties, as well as the preferred soldering temperature and the operating temperature of the device being soldered.

Alloys can be indium-contained, gold-contained, lead-free, fusible or standard tin-lead, as well as many others. Read MoreĪ wide assortment of alloys is available in liquidus temperatures that range from 47☌ to 1063☌. Let us help you choose just the right package for your application. Indium metal preforms need specialized packaging to ensure they arrive at your facility safetly and securely. Read More Selecting the Right Packaging for Pure Indium Preforms Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of high-output lasers by reducing voiding, solder volume, and wicking up the die. Thorough drawings ensure you recieve your custome indium preforms sooner.

Missing dimensions can be resolved, but checking for this before sending the drawing can eliminate the time needed to solve the issue. Read More Engineering Drawing / Specifications for Pure Indium Preforms Precision solder is required for these wearable, implantable, and industrial devices as they must be of high-quality and high-reliability, and be long-lasting. The assembly of medical devices uses a wide variety of alternative soldering processes, of which the most frequently used solder products include paste, preforms, wire, spheres, and flux.

Perform preform software#

SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Solder Preforms Blog Articles The Pin-in-Paste Process with Donut-Shaped Preformsįolks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of solder paste for the p.The Indium Corporation & Macartney Family Foundation.